AMAOE MI-9 CPU BGA REBALLING STENCIL FOR REDMI SERIES

AMAOE MI-9 Stencil for Snapdragon 845/Redmi Series 

Motherboard repairs demand accuracy. For technicians working with Snapdragon chipsets, a reliable stencil is essential. The AMAOE MI-9 BGA Reballing Stencil offers a precise, heat-resistant solution for chip-level work on popular Redmi models.

Why This Stencil Matters

• Precision Cut Design: Laser-cut holes ensure perfect alignment with chip pads. This reduces soldering errors and boosts reballing accuracy.
• High-Quality Stainless Steel: Made with durable, magnetic steel that resists warping under heat. Technicians can use it repeatedly without quality loss.
• Broad Compatibility: Supports popular chipsets: Snapdragon 845, SDM710, and devices like Redmi 8, 8SE, and Mix 2S.
• Optimized Thickness: Engineered at the ideal micron level for stable solder paste application. Improves the reliability of solder joints and lowers the risk of chip damage.

Tips for Use & Maintenance

• Align carefully: Ensure chip and stencil are precisely matched to avoid offset pads.
• Clean after each use: Use isopropyl alcohol and a soft brush to remove residue.
• Avoid bending: Store flat, in a dry place to retain shape.
• Use proper heat settings: Follow IC-specific temperature curves for safe reballing

Feature Summary

• Material          High-grade stainless steel, heat-resistant, magnetic surface
• Thickness Optimized for uniform solder spread
• Stencil Type Reballing (BGA), reusable
• Hole Type Precision laser-cut holes for exact solder placement
• Durability Rigid, reusable 
• Compatibility Snapdragon 845, SDM710, Redmi 8, 8SE, Mix 2S

1. SNAPDRAGON - 845
2. SNAPDRAGON 710
3. SDM845
4. SDM710
5. REDMI 8
6. REDMI 8SE
7. REDMI MIX 2S

Package includes:

• 1 x Stencil