Amaoe Ov-1 BGA Reballing Stencil for Precision IC Repair
The Amaoe OV1 CPU BGA Reballing Stencil is a high-quality precision tool designed for professionals engaged in motherboard and IC chip soldering work. Engineered with accuracy and durability in mind, this stencil is compatible with a variety of CPU chips and supports efficient tin planting and reballing.
Key Features
- High-precision BGA stencil for CPU chip reballing
- Strong stainless steel for long-term use
- Ultra-thin profile with exact hole alignment
- Minimizes solder waste and improves accuracy
- Designed for reusability and stability during work
Best For
- Motherboard repair professionals
- BGA reballing technicians
- IC chip soldering experts
- PCB-level CPU rework labs
Specification
- Brand: Amaoe
- Model: OV1
- Material: High-strength stainless steel
- Thickness: 0.12mm approx
- Stencil Type: CPU BGA reballing stencil
- Reusability: Yes
- Application: Cpu IC chip tin planting
- Compatibility: Multiple CPU platforms supported
Supported for:
- MT6755V
- 6750V CPU
- R9
- A59
- A37
- Y67
Package includes:
