Amaoe MP-1 Series Power IC BGA Rework Reballing Stencil 0.12MM

AMAOE MP1 Series Power IC Reballing Stencil is engineered for precision rework of Qualcomm and MTK power management chips. Made from durable stainless steel, it provides optimal alignment and pad accuracy for fine-pitch IC soldering. Suitable for mobile motherboard repair and ideal for technicians performing chip-level service.

Features

• Ultra-thin 0.12mm stainless steel stencil
• Designed for Power IC rework and BGA reballing
• Supports popular Qualcomm & MediaTek PMICs
• Laser-cut precision holes for clean solder deposit
• Compatible with universal reballing stations
• Reusable, corrosion-resistant & technician-approved

Model Numbers Supported

Qualcomm

• PM660
• M660A
• PM660L
• PM670
• PM670A
• PM670L
• PM845
• PM540
• PM640

MediaTek (MTK)

• 0.40X16X16
• 0.35X12X12
• MT6358W
• MT6356W
• MT6355W
• MT6357V
• MT6357CRV
• MT6335WP
• MT6336WP
• MT6370P
• MT6371P

Package Content*

1x AMAOE MP-1 SERIES POWER IC BGA REWORK REBALLING STENCIL 0.12MM