Product Id: 2940
- Item Code/Product Code: IBGA 12 PRO
- Weight: 0.20kg
Description
Mechanic iBGA 12 Pro 10 in 1 motherboard middle rework tin mesh platform for iPhone X-12 Pro Max repair. Mechanic motherboard middle frame positioning tin planting platform for iPhone X-12 Pro Max motherboard middle layer soldering repair.
Features:
1. Mechanic iBGA 12 Pro 10 in 1 set: for iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini.
2. Strong magnetic automatic positioning: Built-in strong magnetic adsorption, double-sided automatic positioning.
3. High precision and precise alignment: The stencil and pad tightly, make solder paste scraping and tin planting easier.
4. Remove the stencil and plant the tin, the tin ball is full and uniform: Effectively prevent stencil from bulging make the service life longer.
Product Specification:
Item Name: Mid-level Motherboard Positioning Tin Platform
Brand: Mechanic
Model: iBGA 12 Pro
Color: Blue
Product Size: 65*105*11mm
Packing Size: 95*125*20mm
Net Weight: 175g
Gross Weight: 205g
Scope of Application: Perfect iPhone X/XS/XS Max/11/11 Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini motherboard box RF small board positioning, tin-plating repair applications.
