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New
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: MI 4
AMAOE MI-4 BGA Reballing Stencil for MSM8994/8996 CPUs, Compatible with Xiaomi Mi4, Mi4i, Mi MaxAMAOE MI-4 BGA Stencil is perfect for reballing Xiaomi Mi 4, Mi 4i, and Mi Max. Also compatible with MSM8917, SDM845, SM8150, MI-11, Qu 4, EU3 CPUs. Works like Amaoe EU3 Stencil. Ideal Mi 4 stencil for Am..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: MI 8
AMAOE MI-8 BGA Reballing Stencil for Xiaomi Mi 8 Series RepairsThe AMAOE MI-8 stencil module ensures precise BGA reballing for MSM8956 / 8976 / 8998 CPU chips, ideal for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 repairs.Why Choose the AMAOE MI-8 StencilPrecision Laser-Cut Holes: Each hole is engineered ..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "AMAOE Middle Layer Stencil for iPhone 15, 15 Plus Reballing")
New
Brand: AMAOE
Item Code/Product Code: iP 15/Plus
Amaoe iPhone 15, 15 Plus Middle Layer Reballing StencilFor accurate iPhone 15 and 15 Plus middle layer repairs, a specialized stencil is indispensable. The intricate nature of stacked motherboards demands extreme precision for reballing interconnects. Achieve precise iPhone 15, 15 Plus middle l..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U-Tensor
Amaoe U-Tensor BGA Stencil for Google Phone Tensor CPUThe Amaoe U-Tensor 0.12mm Lower Layer BGA Reballing Stencil is engineered for precise soldering of Google's Tensor CPU chips. Its fine design, durable construction, and high reusability make it essential for professional chip-level repa..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹140.00
Ex Tax:₹140.00
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