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-29 %
Brand: AMAOE
Item Code/Product Code: 28IN1
Amaoe 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X-16PMPackage includes:2 x Tin Scraping Blade5 x Positioning Plate1 x Magnetic Base1 x Tin Insulation18 x Stencil..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
Brand: AMAOE
Item Code/Product Code: F-A16
AMAOE F-A16 Solder Mask UV Green Oil Repair Stencil for iPhone 14/15 Reballing – Precision IC Fix ToolFeatures:Solder mask repair green oil UV stencilEach stencil is proofread according to the original factory drawings to ensure that every solder joint must not be missing, completely consistent with..
₹99.00
Ex Tax:₹99.00
New
Brand: AMAOE
Item Code/Product Code: 6/6P
AMAOE IP 6/6PLUS BGA IC REWORK
REBALLING STENCILThe AMAOE OP-1 IC Reballing Stencil provide the accuracy and reliability necessary for precise chip rework, making complex repairs more manageable. A high-quality BGA reballing stencil is fundamental for this intricate process. Purpose: Sp..
₹140.00
Ex Tax:₹140.00
-30 %
Out Of Stock
Brand: AMAOE
Item Code/Product Code: LCD-3
Amaoe Lcd-3 Bga Reballing Stencil For Iphone 6S To 14 Screen Ic / Face / Tailboard / Infrared / True ColorUpgrade your mobile repair toolkit with the AMAOE LCD-3 BGA Reballing Stencil, designed for iPhone 6S to 14 pro max. Perfect for screen IC, face ID, tailboard, infrared, and true tone color repa..
₹140.00 ₹200.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00
New
Brand: MIJING
Item Code/Product Code: Z20 Pro
MiJing Z20 Pro Motherboard Middle Layer Planting Tin Platform for iPhone X to 16 Pro MaxThe Mijing Z20 Pro is a professional-grade BGA reballing stencil platform designed for iPhone models from X to 16 Pro Max. It facilitates accurate and efficient reballing of middle-layer PCBs, ensuring damage-fre..
₹3,650.00
Ex Tax:₹3,650.00
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