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New
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS-2 Stencil 0.12mm BGA Reballing Stencil for IC Chip & PCB RepairFeatures:..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OP-1
AMAOE OP-1 IC Reballing Stencils for OPPO/ VIVO Mobile Chip Repair-0.12MMFor highly accurate Qualcomm SDM660 CPU reballing, a specialized stencil is indispensable. Repairing complex CPU components on mobile motherboards demands absolute precision to ensure device stability.Key Features & User
B..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-1
Amaoe Ov-1 BGA Reballing Stencil for Precision IC RepairThe Amaoe OV1 CPU BGA Reballing Stencil is a high-quality precision tool designed for professionals engaged in motherboard and IC chip soldering work. Engineered with accuracy and durability in mind, this stencil is compatible with a variety of..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: SAM-17
AMAOE SAM-17 BGA reballing stencil for Samsung Exynos processors, featuring precise hole positioning for professional motherboard repair and component rework.Features:Precision-engineered stainless steel construction for durabilityThickness 0.12MMHigh-temperature resistant for repeated useAcc..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹140.00
Ex Tax:₹140.00
New
Item Code/Product Code: GS01
JTX GS01 Green UV Solder Mask for Qualcomm Series IC RepairJTX GS-01 is a 17-piece UV green solder mask stencil set designed for mobile motherboard repair. Ideal for iPhone, Qualcomm, and BGA IC protection. Helps prevent short circuits during soldering with clean, accurate masking.Specifications &am..
₹545.00
Ex Tax:₹545.00
-250x250.jpg "JTX JT-6 BGA Soldering Test Practice Board for Chip Rework Training")
-250x250.jpg "JTX JT-6 BGA Soldering Test Practice Board for Chip Rework Training")
New
Item Code/Product Code: JT-6
Jitongxue JT-6 JTX Micro Soldering Test Practice Board For StudentsMaster BGA soldering skills with the JTX JT-6 practice board—perfect for technicians Students and learners to safely test chip removal, flying wire, and connector work. Master precision soldering with the JTX JT-6 BGA Soldering ..
₹200.00
Ex Tax:₹200.00
-250x250.jpg "Mechanic 210 Omega Series Solder Flux Paste for BGA SMD Rework")
New
Brand: MECHANIC
Item Code/Product Code: 210 Omega
Mechanic 210 Omega Series Solder Flux Paste for BGA SMD ReworkModern motherboard and IC-level repairs demand a flux that performs without compromise. Whether you're reballing a CPU or cleaning up oxidized solder pads, poor-quality flux can ruin a repair. MECHANIC Ω210 Omega Series Solder Flux Past..
₹275.00
Ex Tax:₹275.00
Out Of Stock
Brand: MECHANIC
Item Code/Product Code: IBGA 12 PRO
DescriptionMechanic iBGA 12 Pro 10 in 1 motherboard middle rework tin mesh platform for iPhone X-12 Pro Max repair. Mechanic motherboard middle frame positioning tin planting platform for iPhone X-12 Pro Max motherboard middle layer soldering repair.Features:1. Mechanic iBGA 12 Pro 10 in 1 set: for ..
₹1,650.00
Ex Tax:₹1,650.00