Search Criteria
Products meeting the search criteria
-250x250.jpg "Bagua Mini-One Heater IC Glue Removal Heater 160°C–250°C")
New
Item Code/Product Code: Mini one
Bagua Mini One Heater IC Glue Removal Heater 160°C–250°C Range for Mobile Logic Board RepairBagua Mini-One Heater IC Glue Removal Heater is a compact, high-efficiency heating tool specially designed for safe and precise IC glue removal in mobile phone logic board repair. With a controlled temperatur..
₹1,050.00
Ex Tax:₹1,050.00
-33 %
Brand: MECHANIC
Item Code/Product Code: QC-20
MECHANIC BGA-IC QC-20 SUPER GLUE REMOVER AGENT 20ML
Feature:
20ml BGA IC glue epoxy remover.
Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyuretha..
₹299.00 ₹449.00
Ex Tax:₹299.00
-8 %
Brand: RELIFE
Item Code/Product Code: RL-039
Instructions :Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobil..
₹550.00 ₹599.00
Ex Tax:₹550.00
Showing 1 to 3 of 3 (1 Pages)