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New
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS 2 Stencil High-Precision 0.12mm BGA Reballing Stencil for IC Chip, PCB, and Logic Board Repair – Supports Modules like CPU, PMIC, NAND, and EMMC..
₹145.00
Ex Tax:₹145.00
-28 %
Brand: AMAOE
Item Code/Product Code: LPDDR-1
Amaoe LPDDR-1 Emmc Emcp Bga Reballing Stencil For Ufs Font BGA Reballing Stencil 0.15MM.Features :
1. Brand New.
2. Bga Stencil For Reballing Pins For Bga Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh
Advantage:
1. Deformation Resistan..
₹145.00 ₹200.00
Ex Tax:₹145.00
Brand: AMAOE
Item Code/Product Code: M53
Features:
NO-Clean, lead-free, environmental soldering paste flux.
Good solder ability, insulation resistance, no spattering and non-corrosive.
Great soldering paste for smartphone, PCB, BGA, SMD rework.
Widely used in adapted to the mobile phone repair industry, computer digital service i..
₹250.00
Ex Tax:₹250.00
New
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹145.00
Ex Tax:₹145.00
-12 %
Brand: IC FRIEND
Item Code/Product Code: 13IN1
ICFRIEND NB EMMC BGA 13 in 1 is designated for direct EMMC memory chips connection with the wide range of supported BGA types.
Compatible Boxes
Medusa Pro Box
Octoplus Pro Box
Z3X Easy Jtag Plus Box
Riff Box 2
EMMC Pro Tool
GPG EMMC Box
ATF
UFI Box
Compatible eMMC BGA
BGA100
BG..
₹7,950.00 ₹9,000.00
Ex Tax:₹7,950.00
-10 %
Brand: IC FRIEND
Item Code/Product Code: BGA-95
IC Friend Easy Jtag Ufs-Bga95 Isp Socket Adapter.
IC FRIEND EASY JTAG ISP Adapters – the adapter allows you to make a direct connection of eMMC memory and perform reading and/or writing.
EASY BOX and EMMC compatible adapter. It has the ability to solder the U2 encryption system – the a..
₹899.00 ₹1,000.00
Ex Tax:₹899.00
-22 %
Out Of Stock
Brand: KAISI
Item Code/Product Code: 220 DEGREE
Kaisi 40g 220°C High-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA RepairFeatures:
Kaisi 40g 220°C High-temperature solder paste, a high-temperature lead-free solder paste customised for high-end motherboard repair
Tin Lighting/Climbing Tin Strong/High Purity/Temperature Stand..
₹350.00 ₹450.00
Ex Tax:₹350.00
-10 %
Out Of Stock
Brand: MECHANIC
Item Code/Product Code: 225
Product DescriptionFeatures :New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.Use of efficient energy thixotropic agents, printing and preheating collapse, special solder ensure a good printing and fine pattern can be effectively prevented.More ad..
₹199.00 ₹220.00
Ex Tax:₹199.00
Out Of Stock
Brand: MECHANIC
Item Code/Product Code: IBGA 12 PRO
DescriptionMechanic iBGA 12 Pro 10 in 1 motherboard middle rework tin mesh platform for iPhone X-12 Pro Max repair. Mechanic motherboard middle frame positioning tin planting platform for iPhone X-12 Pro Max motherboard middle layer soldering repair.Features:1. Mechanic iBGA 12 Pro 10 in 1 set: for ..
₹1,650.00
Ex Tax:₹1,650.00