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-250x250.jpg "2UUL SC06 Hand Actuated Glue Gun for Needle Paste 30ML Tube")
Brand: 2UUL
Item Code/Product Code: SC06
2UUL SC06 Hand Actuated Glue Gun for 30ML Adhesive TubeIn mobile repair and precision assembly work, applying glue directly from a tube often causes uneven pressure, messy overflow, and material wastage. Inconsistent adhesive flow can affect bonding strength and reduce professional finishing quality..
₹350.00
Ex Tax:₹350.00
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹140.00
Ex Tax:₹140.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS-2 Stencil 0.12mm BGA Reballing Stencil for IC Chip & PCB RepairFeatures:..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
-30 %
Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-5
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO 0.12MM
AMAOE OV 5 BGA stencils are built for reballing power ICs on OPPO/VIVO smartphones. Made with durable Japanese steel and square-hole design for precise alignment. Ideal for professional-level IC rework and reballing with reliable heat resistanc..
₹140.00 ₹200.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
-30 %
Out Of Stock
Brand: AMAOE
Item Code/Product Code: OV-1
Amaoe Ov-1 BGA Reballing Stencil for Precision IC RepairThe Amaoe OV1 CPU BGA Reballing Stencil is a high-quality precision tool designed for professionals engaged in motherboard and IC chip soldering work. Engineered with accuracy and durability in mind, this stencil is compatible with a variety of..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹140.00
Ex Tax:₹140.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: U-MTU3
Professional-grade reballing (AMAOE U MTU3 ) stencil for MediaTek Dimensity processors, providing precise BGA rework solution with accurate ball placement for reliable mobile device repair services.Features:High-precision stainless steel construction for extended durabilityLaser-cut holes for accura..
₹140.00
Ex Tax:₹140.00