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-33 %
Brand: MECHANIC
Item Code/Product Code: QC-20
MECHANIC BGA-IC QC-20 SUPER GLUE REMOVER AGENT 20ML
Feature:
20ml BGA IC glue epoxy remover.
Can help you soften & remove resinating / sealing glue of chip BGA IC of mobile phones easily.
Can quickly soften and loosen solidified resin adhesive such as epoxy, phenolics, acrylate, polyuretha..
₹299.00 ₹449.00
Ex Tax:₹299.00
-8 %
Brand: RELIFE
Item Code/Product Code: RL-039
Instructions :Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobil..
₹550.00 ₹599.00
Ex Tax:₹550.00
-250x250.jpg "YCS 2015 Desoldering Wick Cleaning Tin Absorbing Wire - ( Width 2.0MM / Length 1.5M )")
New
-50 %
Brand: YCS
Item Code/Product Code: YCS 2015
YCS 2mm / 1.5m 5PCS 2015 Desoldering Braid Solder Remover Wick The YCS 2mm Desoldering Braid is a high-quality solder remover wick designed for precision PCB repair and rework. Made from 99% pure copper, it quickly absorbs molten solder, leaving clean pads for rework, e..
₹60.00 ₹120.00
Ex Tax:₹60.00
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