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Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-Tensor
Amaoe U-Tensor BGA Stencil for Google Phone Tensor CPUThe Amaoe U-Tensor 0.12mm Lower Layer BGA Reballing Stencil is engineered for precise soldering of Google's Tensor CPU chips. Its fine design, durable construction, and high reusability make it essential for professional chip-level repa..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹140.00
Ex Tax:₹140.00
Item Code/Product Code: GS01
JTX GS01 Green UV Solder Mask for Qualcomm Series IC RepairJTX GS-01 is a 17-piece UV green solder mask stencil set designed for mobile motherboard repair. Ideal for iPhone, Qualcomm, and BGA IC protection. Helps prevent short circuits during soldering with clean, accurate masking.Specifications &am..
₹545.00
Ex Tax:₹545.00
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹140.00
Ex Tax:₹140.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 67
The QIANLI QS-67 BGA IC Rework Reballing Stencil is designed for precise reballing of mobile BGA ICs, ensuring accurate soldering and easy repair tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design ..
₹140.00
Ex Tax:₹140.00
Brand: RELIFE
Item Code/Product Code: RL-062D
Relife RL-062D Manual Labor-saving Glue Gun for 5~10CC Solder Paste / Solder Oil / UV AdhesiveThe Relife RL-062D manual labor-saving glue gun is designed for 5cc/10cc tubes. Ideal for solder paste, UV glue, and flux applications in phone repair. Easy to control, fatigue-free grip, and perfect for pr..
₹99.00
Ex Tax:₹99.00
Brand: RELIFE
Item Code/Product Code: RL-093A
Relife RL-093A Ultra-Thin 0.1MM Copper Chip Heat SinkRelife RL‑093A is a premium 0.1 mm ultra-thin copper heat sink sheet designed for BGA, IC, and CPU cooling during soldering and rework. It combines exceptional thermal conductivity, corrosion resistance, and smooth, burr-free edges—making it perf..
₹220.00
Ex Tax:₹220.00
Item Code/Product Code: IP 12
WL Gold BGA CPU IC Reballing Stencil Tin Net for iPhone 12 /12 PRO/ 12 PRO MAX
WL Gold BGA Reballing Stencil is designed for CPU IC repair on iPhone 12, 12 Pro, and 12 Pro Max. Made from premium gold-coated steel, this durable tin net offers high precision, repeat use, and easy alignment for..
₹550.00
Ex Tax:₹550.00
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