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New
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair technicians seeking reliable reballing solutions.FeaturesMaterial &..
₹350.00
Ex Tax:₹350.00
New
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹350.00
Ex Tax:₹350.00
New
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS 2 Stencil High-Precision 0.12mm BGA Reballing Stencil for IC Chip, PCB, and Logic Board Repair – Supports Modules like CPU, PMIC, NAND, and EMMC..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: S23 FE-012
AMAOE S23 FE-012 Middle Frame Premium BGA reballing stencil for Samsung S23 FE middle frame components, ensuring precise solder ball placement during chipset repair and replacement. Features:High-quality stainless steel constructionThickness: 0.12MMHeat-resistant design for prolonged useCo..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: SAM-17
AMAOE SAM-17 BGA reballing stencil for Samsung Exynos processors, featuring precise hole positioning for professional motherboard repair and component rework.Features:Precision-engineered stainless steel construction for durabilityThickness 0.12MMHigh-temperature resistant for repeated useAcc..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-MTU3
Professional-grade reballing (AMAOE U MTU3 ) stencil for MediaTek Dimensity processors, providing precise BGA rework solution with accurate ball placement for reliable mobile device repair services.Features:High-precision stainless steel construction for extended durabilityLaser-cut holes for accura..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-QSD7
Premium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel construction for durabilityLaser-cut holes ensure accur..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹145.00
Ex Tax:₹145.00
New
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹145.00
Ex Tax:₹145.00