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Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-1
Amaoe Ov-1 BGA Reballing Stencil for Precision IC RepairThe Amaoe OV1 CPU BGA Reballing Stencil is a high-quality precision tool designed for professionals engaged in motherboard and IC chip soldering work. Engineered with accuracy and durability in mind, this stencil is compatible with a variety of..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "Bagua Mini-One Heater IC Glue Removal Heater 160°C–250°C")
-24 %
Brand: BGTOOLS (Bagua)
Item Code/Product Code: Mini one
Bagua Mini One IC Heater Glue Removal Heater 160°C–250°C Range for Mobile Logic Board RepairBagua Mini-One Heater IC Glue Removal—also known as BG Tools Mini-One Heater—is a compact, high-efficiency heating tool specially designed for safe and precise IC glue removal in mobile phone ..
₹799.00 ₹1,050.00
Ex Tax:₹799.00
Item Code/Product Code: BG Pad
BG Multifunctional Magnetic Heat-Resistant Silicone Pad for IC Reballing and Soldering WorkstationThe BG Multifunctional Silicone Pad is a high-grade, magnetic, and heat-resistant repair mat designed for mobile IC reballing, soldering, and PCB repair. It protects your workstation from heat damage, o..
₹445.00
Ex Tax:₹445.00
-250x250.jpg "Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC Reballing")
Out Of Stock
Item Code/Product Code: SAM 16
Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC ReballingThe Gizmo SAM16 Green Oil UV Stencil is designed for professional chip-level repair. It offers accurate UV oil masking for IC base treatment during reballing or IC removal. Gizmo Power stencil for SAM:16, BGA254, 1280-E8825 &..
₹100.00
Ex Tax:₹100.00
Brand: JTX
Item Code/Product Code: GS01
JTX GS01 Green UV Solder Mask for Qualcomm Series IC RepairJTX GS-01 is a 17-piece UV green solder mask stencil set designed for mobile motherboard repair. Ideal for iPhone, Qualcomm, and BGA IC protection. Helps prevent short circuits during soldering with clean, accurate masking.Specifications &am..
₹599.00
Ex Tax:₹599.00
Out Of Stock
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹140.00
Ex Tax:₹140.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 67
The QIANLI QS-67 BGA IC Rework Reballing Stencil is designed for precise reballing of mobile BGA ICs, ensuring accurate soldering and easy repair tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design ..
₹140.00
Ex Tax:₹140.00