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Item Code/Product Code: MAGIC PAD
Multi-functional positioning pressure-reducing magic protective pad supports for iPhone X-11 lattice fixed pad 7G-8P fingerprint CPU repair, 115x97mm tin planting thermal silicone mat. Hong Hai Tong magic pad is used to repair the iPhone X-11Pro Max face dot matrix repair 7-8P fingerprint ..
₹299.00 ₹400.00
Ex Tax:₹299.00
New
Item Code/Product Code: T4 Pro
JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android RAMFeatures:
T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models a total of 84 models of chips
The 2-in-1 design greatly hel..
₹1,745.00
Ex Tax:₹1,745.00
Item Code/Product Code: MD-1
Multifunctional Positioning Pressure Reducing Silicon Magic Pad Is Specially Designed for BGA CPU IC Reballing
1. Especially designed for BGA chips repair.
2. CPU planting tin, dynamic leveling of planting tin net, protect chip more secure.
3. Avoid tin messing caused by the deformation of stee..
₹399.00
Ex Tax:₹399.00
Out Of Stock
Item Code/Product Code: TE-186
Product Overview:Non-slipUltra-thin-bucklenon-blocking knifeProduct Details:Adjust the distance of the double nozzles freely to be left and rightAccurate card slot, minimum distance up to 1mm, maximum distance up to 22mmNon-slip design at the bottomBGA Size 1.5-20MMPacking Content*1x TE-186 Uni..
₹1,099.00
Ex Tax:₹1,099.00
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