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-250x250.jpg "2UUL SC10 CPU Fever Paste Thermal Cooling Gel for CPU Repair-50g")
Brand: 2UUL
Item Code/Product Code: SC 10
2UUL SC10 Cooling Gel for CPU After Rework & Overheating Protection – 50g 2UUL SC10 is a specialized CPU cooling gel crafted for mobile repair pros. It's ideal for use after CPU reballing, IC rework, or chip replacement in modern SoCs like Snapdragon, MediaTek, or Apple A-series. It ensures..
₹250.00
Ex Tax:₹250.00
-250x250.jpg "77621-31 Mobile IC for for iPhone 7 and 8 Series")
Item Code/Product Code: 77621-31
77621 31 Audio IC for iPhone Logic Board Sound RepairThe 77621 31 Mobile IC is an original audio integrated circuit designed for repairing sound-related faults on iPhone logic boards. This chip plays a crucial role in processing audio input and output signals, enabling stable microphone and speaker ..
₹99.00
Ex Tax:₹99.00
New
-51 %
Item Code/Product Code: 77643-21
77643 21 mobile integrated circuit for board level repair workMobile phones often fail due to damaged or faulty ICs on the motherboard, leading to power issues, charging faults, or device instability. Replacing the correct IC is critical to restore proper circuit functionality. The 77643 21 Mobile I..
₹99.00 ₹200.00
Ex Tax:₹99.00
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair techni..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-9
Professional-grade Amaoe OV-9 reballing stencil for MediaTek and Snapdragon processors in OPPO/VIVO smartphones. High-precision template ensures accurate chip soldering during motherboard repair.Features:Precision-engineered stainless steel construction for durabilityCompatible with multi..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: S23 FE-012
AMAOE S23 FE-012 Middle Frame Premium BGA reballing stencil for Samsung S23 FE middle frame components, ensuring precise solder ball placement during chipset repair and replacement. Features:High-quality stainless steel constructionThickness: 0.12MMHeat-resistant design for prolonged useCo..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00