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Brand: 2UUL
Item Code/Product Code: SC 10
2UUL SC10 Cooling Gel for CPU After Rework & Overheating Protection – 50g 2UUL SC10 is a specialized CPU cooling gel crafted for mobile repair pros. It's ideal for use after CPU reballing, IC rework, or chip replacement in modern SoCs like Snapdragon, MediaTek, or Apple A-series. It ensures..
₹250.00
Ex Tax:₹250.00
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair techni..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-9
Professional-grade Amaoe OV-9 reballing stencil for MediaTek and Snapdragon processors in OPPO/VIVO smartphones. High-precision template ensures accurate chip soldering during motherboard repair.Features:Precision-engineered stainless steel construction for durabilityCompatible with multi..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: S23 FE-012
AMAOE S23 FE-012 Middle Frame Premium BGA reballing stencil for Samsung S23 FE middle frame components, ensuring precise solder ball placement during chipset repair and replacement. Features:High-quality stainless steel constructionThickness: 0.12MMHeat-resistant design for prolonged useCo..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD7
Amaoe U-QSD7 Stencil for Snapdragon 7-SeriesPremium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel constructio..
₹140.00
Ex Tax:₹140.00
Brand: BGTOOLS (Bagua)
Item Code/Product Code: Mini one
Bagua Mini One IC Heater Glue Removal Heater 160°C–250°C Range for Mobile Logic Board RepairBagua Mini-One Heater IC Glue Removal—also known as BG Tools Mini-One Heater—is a compact, high-efficiency heating tool specially designed for safe and precise IC glue removal in mobile phone ..
₹1,050.00
Ex Tax:₹1,050.00