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-250x250.jpg "2UUL SC10 CPU Fever Paste Thermal Cooling Gel for CPU Repair-50g")
New
Brand: 2UUL
Item Code/Product Code: SC 10
2UUL SC10 CPU Fever Paste-50g for Cooling CPU After RepairThis content helps repair technicians and photographers identify a safe and residue-free cleaning solution for sensitive surfaces like optical lenses, screens, and camera modules. With 2UUL’s established brand credibility in mobile repair, th..
₹250.00
Ex Tax:₹250.00
New
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: OV-9
Professional-grade Amaoe OV-9 reballing stencil for MediaTek and Snapdragon processors in OPPO/VIVO smartphones. High-precision template ensures accurate chip soldering during motherboard repair.Features:Precision-engineered stainless steel construction for durabilityCompatible with multi..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U-QSD7
Premium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel construction for durabilityLaser-cut holes ensure accur..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-250x250.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
New
Brand: YCS
Item Code/Product Code: Arc Pad
YCS Arc Pad BGA Tin Planting Mat with Magnetic Steel Mesh for CPU/IC RepairThe YCS Tin-Planting Arc Pad is a high-precision tool for IC and BGA chip tin planting. It helps in forming uniform solder balls, reducing errors in reballing processes. Ideal for technicians and repair professionals handling..
₹299.00
Ex Tax:₹299.00
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