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-250x250.jpg "2UUL SC10 CPU Fever Paste Thermal Cooling Gel for CPU Repair-50g")
Brand: 2UUL
Item Code/Product Code: SC 10
2UUL SC10 Cooling Gel for CPU After Rework & Overheating Protection – 50g 2UUL SC10 is a specialized CPU cooling gel crafted for mobile repair pros. It's ideal for use after CPU reballing, IC rework, or chip replacement in modern SoCs like Snapdragon, MediaTek, or Apple A-series. It ensures..
₹250.00
Ex Tax:₹250.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-9
Professional-grade Amaoe OV-9 reballing stencil for MediaTek and Snapdragon processors in OPPO/VIVO smartphones. High-precision template ensures accurate chip soldering during motherboard repair.Features:Precision-engineered stainless steel construction for durabilityCompatible with multi..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD7
Amaoe U-QSD7 Stencil for Snapdragon 7-SeriesPremium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel constructio..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC Reballing")
Item Code/Product Code: SAM 16
Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC ReballingThe Gizmo SAM16 Green Oil UV Stencil is designed for professional chip-level repair. It offers accurate UV oil masking for IC base treatment during reballing or IC removal. Gizmo Power stencil for SAM:16, BGA254, 1280-E8825 &..
₹100.00
Ex Tax:₹100.00
-250x250.jpg "YCS Magnetic Pad for IC Reballing & BGA Tin Planting – Anti-Slip Base")
-250x250.jpg "YCS Magnetic Pad for IC Reballing & BGA Tin Planting – Anti-Slip Base")
Out Of Stock
Brand: YCS
Item Code/Product Code: Arc Pad
YCS Arc Pad BGA Tin Planting Mat with Magnetic Steel Mesh for CPU/IC RepairThe YCS Strong Magnetic Pad Chip is engineered to hold small and medium ICs, chips, or CPUs steadily during reballing or soldering. This anti-slip magnetic base ensures precision placement and stability without damaging the c..
₹299.00
Ex Tax:₹299.00
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