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Brand: QIANLI / TOOLPLUS
Item Code/Product Code: A11 CPU
Manufacturer:QianLiCompatible With:iPhone 8What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 8 - S500If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right part befor..
₹200.00
Ex Tax:₹200.00
Out Of Stock
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: A9 CPU
Manufacturer:QianLi/ToolPlusCompatible With:iPhone 6SWhat’s Included:1 x QianLi BGA Stencil Template - A9 CPU Module - iPhone 6S - E300..
₹200.00
Ex Tax:₹200.00
Brand: AMAOE
Item Code/Product Code: MI 3
The MI3 stencil is designed for MSM8916/8928/MT6592 CPUs found in Xiaomi Redmi Note, Redmi 2/2A devicesThe AMAOE MI3 stencil is a special tool for BGA reballing. Technicians use it for advanced repairs on smartphone motherboards, especially for Xiaomi devices. Here's what it's used for:The MI3 stenc..
₹140.00
Ex Tax:₹140.00
Item Code/Product Code: HI6250
1.This is the Mobile phone components,
2. Please master the replacement technology yourself or ask a professional to replace it!3.To ensure successful repair using
4. In use,&nbs..
₹350.00
Ex Tax:₹350.00
Item Code/Product Code: MD-1
Multifunctional Positioning Pressure Reducing Silicon Magic Pad Is Specially Designed for BGA CPU IC Reballing
1. Especially designed for BGA chips repair.
2. CPU planting tin, dynamic leveling of planting tin net, protect chip more secure.
3. Avoid tin messing caused by the deformation of stee..
₹399.00
Ex Tax:₹399.00
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