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New
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS 2 Stencil High-Precision 0.12mm BGA Reballing Stencil for IC Chip, PCB, and Logic Board Repair – Supports Modules like CPU, PMIC, NAND, and EMMC..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹145.00
Ex Tax:₹145.00
Out Of Stock
Item Code/Product Code: TE-079
☀Size: The plane length of our mobile phone motherboard repair jig is about 180 mm/7.1 inches, the plane width is about 90 mm/3.5 inches, and the plane height is about 8 mm/0.3 inches. The reasonable design can fully meet your daily maintenance needs of the motherboard
☀Integrated Design: The botto..
₹1,050.00
Ex Tax:₹1,050.00
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