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Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: 28IN1
Amaoe 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X-16PMPackage includes:2 x Tin Scraping Blade5 x Positioning Plate1 x Magnetic Base1 x Tin Insulation18 x Stencil..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
Item Code/Product Code: JP-1
JTX JP-1 Universal Preheating Platform for Motherboard Planting Tin / Degumming / LaminatedFeatures:
Universal preheater, Layering/Laminated/Reballing/Glue removal all in one
Disassembly and assembly of precision components such as chips and connectors, etc., free temperature control, safe a..
₹1,450.00
Ex Tax:₹1,450.00
Brand: MIJING
Item Code/Product Code: K35
MIJING K35 MULTI-FUNCTION PCB BOARD HOLDER FIXTURE FOR IPHONE 12/12MINI/12PRO/12PROMAXFeature:
Support Phone 12/12Mini/12PRO/12PROMAX
General mobile phone maintenance fixture, rotary fixed design, no rebound, fixed firmly! The design has three adjustable distances.
Prevent clamps from movin..
₹2,500.00
Ex Tax:₹2,500.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: 4 IN 1
DESCRIPTION :4 in 1 Qianli iPhone 12 series motherboard middle layer reballing fixture, Qianli Middle layer reballing soldering platform with stencils for iPhone 12 motherboard repair. Qianli middle frame reballing platform for iPhone 12/12 Pro/12 Pro Max/12 MINI. FEATURES :1. Precise pos..
₹1,999.00
Ex Tax:₹1,999.00
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