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New
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
-29 %
Brand: AMAOE
Item Code/Product Code: 28IN1
Amaoe 28-in-1 0.12mm Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone X-16PMPackage includes:2 x Tin Scraping Blade5 x Positioning Plate1 x Magnetic Base1 x Tin Insulation18 x Stencil..
₹3,899.00 ₹5,500.00
Ex Tax:₹3,899.00
New
Brand: AMAOE
Item Code/Product Code: OP-1
AMAOE OP-1 IC Reballing Stencils for OPPO/ VIVO Mobile Chip Repair-0.12MMFor highly accurate Qualcomm SDM660 CPU reballing, a specialized stencil is indispensable. Repairing complex CPU components on mobile motherboards demands absolute precision to ensure device stability.Key Features & User
B..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: OV-1
Amaoe Ov-1 BGA Reballing Stencil for Precision IC RepairThe Amaoe OV1 CPU BGA Reballing Stencil is a high-quality precision tool designed for professionals engaged in motherboard and IC chip soldering work. Engineered with accuracy and durability in mind, this stencil is compatible with a variety of..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: SAM-17
AMAOE SAM-17 BGA reballing stencil for Samsung Exynos processors, featuring precise hole positioning for professional motherboard repair and component rework.Features:Precision-engineered stainless steel construction for durabilityThickness 0.12MMHigh-temperature resistant for repeated useAcc..
₹140.00
Ex Tax:₹140.00
Item Code/Product Code: T4 Pro
JTX T4 Pro Universal Chips Glue Removal and Tin Planting Platform Set for iPhone / Samsung / Hisilicon / Android RAMFeatures:
T4 Pro degumming and tin planting platform, support Apple/Huawei/OPPO/VIVO/Honor/Xiaomi/Samsung and other models a total of 84 models of chips
The 2-in-1 design greatly hel..
₹1,745.00
Ex Tax:₹1,745.00
Item Code/Product Code: MD-1
Multifunctional Positioning Pressure Reducing Silicon Magic Pad Is Specially Designed for BGA CPU IC Reballing
1. Especially designed for BGA chips repair.
2. CPU planting tin, dynamic leveling of planting tin net, protect chip more secure.
3. Avoid tin messing caused by the deformation of stee..
₹399.00
Ex Tax:₹399.00
Brand: MIJING
Item Code/Product Code: K35
MIJING K35 MULTI-FUNCTION PCB BOARD HOLDER FIXTURE FOR IPHONE 12/12MINI/12PRO/12PROMAXFeature:
Support Phone 12/12Mini/12PRO/12PROMAX
General mobile phone maintenance fixture, rotary fixed design, no rebound, fixed firmly! The design has three adjustable distances.
Prevent clamps from movin..
₹2,500.00
Ex Tax:₹2,500.00
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