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-250x250.jpg "2UUL SC96 Gold Plated FPC Connector Solder Bar-5 Pcs")
Out Of Stock
Brand: 2UUL
Item Code/Product Code: SC96
2uul SC96 Gold Plated FPC Connector Reballing Solder Bar (without Handle) - 5 PcsMobile logic board repair demands fine precision, especially with delicate FPC connectors. Weak joints or worn pads can easily lead to damage. The 2UUL SC96 Reballing Solder Bar is made to simplify FPC reballing wo..
₹250.00
Ex Tax:₹250.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MI 8
AMAOE MI-8 BGA Reballing Stencil for Xiaomi Mi 8 Series RepairsThe AMAOE MI-8 stencil module ensures precise BGA reballing for MSM8956 / 8976 / 8998 CPU chips, ideal for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 repairs.Why Choose the AMAOE MI-8 StencilPrecision Laser-Cut Holes: Each hole is engineered ..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "Amaoe U QSU6 Qualcomm CPU BGA Reballing Stencil 0.12MM")
New
Brand: AMAOE
Item Code/Product Code: U-QSU6
Amaoe U QSU6 0.12MM Qualcomm CPU integrated BGA stencil for precise reballingReballing Qualcomm CPUs requires exact ball alignment and controlled solder volume. Using incorrect thickness or misaligned stencil often causes short circuits, poor bonding, or uneven solder height. The Amaoe U QSU6 0..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-MTU3
Professional-grade reballing (AMAOE U MTU3 ) stencil for MediaTek Dimensity processors, providing precise BGA rework solution with accurate ball placement for reliable mobile device repair services.Features:High-precision stainless steel construction for extended durabilityLaser-cut holes for accura..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: UN-1
Premium BGA Reballing Stencil for iPhone A14/A15 CPUs, offering precise alignment and superior soldering results for professional repair technicians working on Apple devices.The Amaoe SN-1 Stencil is a high-precision tool designed for accurate solder paste application and BGA reballing in PCB repair..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC Reballing")
Out Of Stock
Item Code/Product Code: SAM 16
Gizmo SAM16 Power Green Oil UV Stencil for Precise BGA IC ReballingThe Gizmo SAM16 Green Oil UV Stencil is designed for professional chip-level repair. It offers accurate UV oil masking for IC base treatment during reballing or IC removal. Gizmo Power stencil for SAM:16, BGA254, 1280-E8825 &..
₹100.00
Ex Tax:₹100.00
Out Of Stock
Brand: MECHANIC
Item Code/Product Code: IR10 PRO
MECHANIC IR10 PRO LCD OCA GLUE CLEANING MOTOR MACHINE
Faster charging, replace the waiting for long time.
Remove OCA Glue Easily.
One button start, easily solve curved screen glue, hard, glue, OCA glue, etc.
Movement integrated high speed motor, stable glue removal.
The front end is illumin..
₹899.00
Ex Tax:₹899.00
Out Of Stock
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repa..
₹199.00
Ex Tax:₹199.00
-250x250.jpg "Relife RL-093A Ultra-Thin 0.1MM Copper Chip Heat Sink for BGA IC Cooling")
Brand: RELIFE
Item Code/Product Code: RL-093A
Relife RL-093A Copper Chip Heat Sink for IC CPU Cooling The Relife RL-093A Copper Chip Heat Sink is crafted for professional mobile technicians to manage heat during IC reballing, CPU repair, or soldering tasks. Made from high-purity copper, it provides rapid thermal conductivity, drawing heat..
₹220.00
Ex Tax:₹220.00