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Brand: AMAOE
Item Code/Product Code: MP-2
Amaoe MP2 0.12mm Power IC BGA Reballing Stencil for Qualcomm/MTKAmaoe MP2 Power IC BGA Reballing Stencil for:
PM7250
PMX55
PM6350
PM7150A
PM7250B
PM4250
PM8350
PM8250
PM7325
PM8350BH
PM8350C
PM8450
PM6225
MT6359VPP
MT6635XP
MT6365VMW
MT6360P/MP/RP
PM7325B
PM7350C
Package includes..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MQ-4
Amaoe MQ:4 CPU BGA Reballing Stencil for Qualcomm Snapdragon SM8350 SM8450 SM7315 SM7325 MTK MT6833V MT6799W MT6877V Supported for:
SM8350
SM8450 RAM
SNAPDRAGON 8Gen1
SM8450
SNAPDRAGON 888
SM8350
SNAPDRAGON 778G
SM7315
SM7325
SNAPDRAGON 810
MT6833V
MT6799W CPU
MT6..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MQ-6
Amaoe MQ:6 CPU BGA Reballing Stencil for Qualcomm Snapdragon.Supported for:
SM6450
SM8650
MT6985W
MT6781V
SM4450
MT6879V
BGA496
MT8781V
Package includes:
1 x Stencil..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MQ 1-4
AMAOE MQ 1-4 SERIES QUALCOMM/MTK POWER IC REWORK REBALLING STENCILS 0.12MMWhen working with complex Qualcomm or MTK power ICs, precision matters. From solder ball placement to stable alignment, even a small error can lead to short circuits or unstable boards. The AMAOE MQ Series Reballing Stenc..
₹580.00 ₹750.00
Ex Tax:₹580.00
Brand: AMAOE
Item Code/Product Code: QU-4
Amaoe QU-4 CPU BGA Reballing Stencil Net Supported for:
MSM8994 B
MSM8974 B
MSM8960 B
MSM8994 A
MSM8974 A
MSM8960 A
Package includes:
1 x Stencil..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U HIS4
AMAOE U HIS4 0.12mm Precision Stencil For HiSilicon Baseband And Processor ICsThe AMAOE U-HIS4 Universal BGA Reballing Stencil is designed for accurate and stable reballing of HiSilicon chipset ICs used in advanced smartphone motherboards. Manufactured with 0.12mm laser-cut stainless steel, this ste..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD6
Amaoe Qualcomm bga stencil 0.12mm for precision ic reballingDuring Qualcomm IC reballing, inaccurate hole alignment or incorrect stencil thickness often causes uneven solder balls, short circuits, or weak joints. Generic stencils fail to match IC layouts, leading to repeated rework and wasted time.&..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD6
AMAOE U QSD6 0.12mm Precision Stencil For Qualcomm PM And Baseband ICsThe AMAOE U-QSD6 Universal BGA Reballing Stencil is engineered for precise reballing of Qualcomm power management and baseband ICs. With a 0.12mm stainless steel thickness, it delivers consistent solder volume, accurate pad alignm..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSU5
AMAOE U QSU5 0.12mm Precision Stencil For Snapdragon Gen Series CPUsThe AMAOE U-QSU5 Universal BGA Reballing Stencil is engineered for high-density Qualcomm Snapdragon CPU reballing, especially for newer Gen-series processors. Manufactured with 0.12mm laser-cut stainless steel, it delivers accurate ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹140.00
Ex Tax:₹140.00
Brand: MECHANIC
Item Code/Product Code: MI-410
MECHANIC MI-410 QUALCOMM POWER IC REWORK REBALLING STENCIL FOR REDMI NOTE 4/4X/PROMODEL NUMBERS SUPPORTED ;REDMI NOTE 4/4X/PROPackage Content*1x MECHANIC MI-410 QUALCOMM POWER IC REWORK REBALLING STENCIL FOR REDMI NOTE 4/4X/PRO..
₹199.00
Ex Tax:₹199.00