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New
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹145.00
Ex Tax:₹145.00
New
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile..
₹145.00
Ex Tax:₹145.00
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