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Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹140.00
Ex Tax:₹140.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repa..
₹199.00
Ex Tax:₹199.00
Out Of Stock
Brand: SUNSHINE
Item Code/Product Code: SS-032
IP X MIDDLE BOARD TINNING PLATFORM SET SS-032SUNSHINE &G-LON co-develop SP-XFixed the problem of Iphone X middle boardX middle layer special tin paste，strong welding force， high resistance.New upgrade for X/XS/XSMAX to solve the problem of IPHONE X Series middle layer tinning..
₹2,000.00
Ex Tax:₹2,000.00
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