Search Criteria
Products meeting the search criteria
-30 %
Out Of Stock
Brand: AMAOE
Item Code/Product Code: MQ-4
Amaoe MQ:4 CPU BGA Reballing Stencil for Qualcomm Snapdragon SM8350 SM8450 SM7315 SM7325 MTK MT6833V MT6799W MT6877V Supported for:
SM8350
SM8450 RAM
SNAPDRAGON 8Gen1
SM8450
SNAPDRAGON 888
SM8350
SNAPDRAGON 778G
SM7315
SM7325
SNAPDRAGON 810
MT6833V
MT6799W CPU
MT6..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD7
Amaoe U-QSD7 Stencil for Snapdragon 7-SeriesPremium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel constructio..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "PM6150-002 Power Management IC for Mobile CPU Reballing - Original")
New
Item Code/Product Code: PM6150-002
PM6150 002 Original Power IC for Vivo V15 Pro, Redmi Note 7 Pro, Samsung Galaxy A70 and Realme 5 ProThe PM6150-002 mobile power IC is designed for advanced power control in Snapdragon-based smartphones. Ideal for board-level repair, especially in CPU reballing and no-power issues. Supports stable cu..
₹160.00
Ex Tax:₹160.00
Showing 1 to 4 of 4 (1 Pages)