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Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹140.00
Ex Tax:₹140.00
New
Item Code/Product Code: GS01
JTX GS01 Green UV Solder Mask for Qualcomm Series IC RepairJTX GS-01 is a 17-piece UV green solder mask stencil set designed for mobile motherboard repair. Ideal for iPhone, Qualcomm, and BGA IC protection. Helps prevent short circuits during soldering with clean, accurate masking.Specifications &am..
₹545.00
Ex Tax:₹545.00
New
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹140.00
Ex Tax:₹140.00
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: QS 63
QIANLI QS-63 BGA Reballing Stencil offers precision reballing for SM6115, SM6125, SM6225 CPU ICs. Ideal for professional mobile motherboard repair and soldering. BGA IC Fixing KitFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repa..
₹199.00
Ex Tax:₹199.00
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