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Products meeting the search criteria
-18 %
Brand: 2UUL
Item Code/Product Code: TW-22
2uul TW22 Non-magnetic Stainless Stencil Tweezers with Holes for Mobile Phone RepairFeatures:
Suitable for circuit board maintenance, digital maintenance, integrated circuit pins, precision small devices, small accessories, etc
High hardness and flexibility / Overall thickening and tight clamping ..
₹245.00 ₹300.00
Ex Tax:₹245.00
Out Of Stock
Brand: QIANLI / TOOLPLUS
Item Code/Product Code: A8 CPU
Manufacturer:QianLiCompatible With:iPhone 6What’s Included:1 x QianLi BGA Stencil Template - A11 CPU Module - iPhone 6 - BMW750If you are ever unsure of how to install your part or would like any assistance, please feel free to contact us.Please make sure you have chosen the right part bef..
₹200.00
Ex Tax:₹200.00
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Out Of Stock
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair techni..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS-2 Stencil 0.12mm BGA Reballing Stencil for IC Chip & PCB RepairFeatures:..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MBGA-12Pro
AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing ToolFeatures:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPreci..
₹145.00
Ex Tax:₹145.00
Brand: AMAOE
Item Code/Product Code: MI 4
AMAOE MI-4 BGA Reballing Stencil for MSM8994/8996 CPUs, Compatible with Xiaomi Mi4, Mi4i, Mi MaxAMAOE MI-4 BGA Stencil is perfect for reballing Xiaomi Mi 4, Mi 4i, and Mi Max. Also compatible with MSM8917, SDM845, SM8150, MI-11, Qu 4, EU3 CPUs. Works like Amaoe EU3 Stencil. Ideal Mi 4 stencil for Am..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MI 8
AMAOE MI-8 BGA Reballing Stencil for Xiaomi Mi 8 Series RepairsThe AMAOE MI-8 stencil module ensures precise BGA reballing for MSM8956 / 8976 / 8998 CPU chips, ideal for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 repairs.Why Choose the AMAOE MI-8 StencilPrecision Laser-Cut Holes: Each hole is engineered ..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "AMAOE Middle Layer Stencil for iPhone 15, 15 Plus Reballing")
Out Of Stock
Brand: AMAOE
Item Code/Product Code: iP 15/Plus
Amaoe iPhone 15, 15 Plus Middle Layer Reballing StencilFor accurate iPhone 15 and 15 Plus middle layer repairs, a specialized stencil is indispensable. The intricate nature of stacked motherboards demands extreme precision for reballing interconnects. Achieve precise iPhone 15, 15 Plus middle l..
₹140.00
Ex Tax:₹140.00
-30 %
Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00