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Out Of Stock
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "MaAnt Universal Black BGA Reballing Stencil")
New
-34 %
Brand: MaANT
Item Code/Product Code: BLK Universal Stencil
.abest-product {
--primary-main: #583F8C;
--primary-dark: #330825;
--primary-light: #CFDEE6;
--surface: #ffffff;
--surface-2: #f8fafc;
--border: rgba(51, 8, 37, 0.08);
--border-md: rgba(51, 8, 37, 0.15);
--text: #330825;
--text-2: #5c4e58..
₹199.00 ₹300.00
Ex Tax:₹199.00
-44 %
Out Of Stock
Brand: NEXST
Item Code/Product Code: UNIVERSAL
Description:
NEXST Black Steel BGA Reballing Stencil Kit 0.3/0.35/0.4/0.5mm multifunction universal steel mesh for tin planting.
Features:
1. High Quality Stainless Steel Reballing Stencil
2. Colour: Black (Square Hole ).
3. Make your repair work easier.
Package contains:
1 x Nexst ..
₹140.00 ₹250.00
Ex Tax:₹140.00
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