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Brand: AMAOE
Item Code/Product Code: U QSD10
The AMAOE U-QSD10 BGA Reballing Stencil is specially designed for Qualcomm Snapdragon 8 Gen 2 (SM8550) processors/SoCs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for professional rework environmentsPr..
₹145.00
Ex Tax:₹145.00
Item Code/Product Code: 0.1MM
Products Details:
Thickness: 0.1mm
Length: 100m
Colour: Red
Packing Details: 1Pcs of Copper Jumper Wire 0. 1mm..
₹15.00
Ex Tax:₹15.00
Brand: MaANT
Item Code/Product Code: SL-1
MaAnt SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinningFeatures:
One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal work
This applies to 99%of the chips on the market, 20mm x 1..
₹1,499.00 ₹1,600.00
Ex Tax:₹1,499.00
Brand: MECHANIC
Item Code/Product Code: MOS-4K
Mechanic MOS4K IMX415 Sensor 51MP 4K Ultra HD Industry Microscope CameraFeatures:
The Mos series camera excels in optical performance and imaging technology, a strong upgrade teaming up with experts, breaking boundaries presenting a unique and stunning image
Equipped with a 1/2.8-inch image sensor..
₹6,190.00 ₹7,500.00
Ex Tax:₹6,190.00
Brand: RELIFE
Item Code/Product Code: RL-039
Instructions :Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobil..
₹550.00 ₹599.00
Ex Tax:₹550.00
Brand: RELIFE
Item Code/Product Code: RL 058
RELIFE RL-058 3 IN 1 CHIP WELDING EQUIPMENTS SOLDER SETDESCRIPTION :1. A set to solve the problem of chip soldering2. Tube type BGA solder paste,Contains imported flux for better soldering effect3. The&nbs..
₹350.00
Ex Tax:₹350.00
Brand: YCS
Item Code/Product Code: CHIP SEAM
YCS Chip Seam Waterproof Black Adhesive.The YCS Chip Seam Waterproof Black Adhesive is a high-performance sealant specifically designed for chip repair and precision bonding in electronics. Its quick-curing formula and black liquid consistency make it ideal for filling gaps and providing a seamless ..
₹299.00 ₹450.00
Ex Tax:₹299.00
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