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Brand: 2UUL
Item Code/Product Code: SC 10
2UUL SC10 Cooling Gel for CPU After Rework & Overheating Protection – 50g 2UUL SC10 is a specialized CPU cooling gel crafted for mobile repair pros. It's ideal for use after CPU reballing, IC rework, or chip replacement in modern SoCs like Snapdragon, MediaTek, or Apple A-series. It ensures..
₹250.00
Ex Tax:₹250.00
Brand: AMAOE
Item Code/Product Code: IP 12PM
Amaoe 0.08 MM Ultra-Thin Middle Layer BGA Reballing Stencil for iPhone 12 Pro Max
The Amaoe 0.08 MM Middle Layer BGA Reballing Stencil is a
high-precision, laser-cut stainless steel stencil designed specifically for
iPhone 12 Pro Max BGA (Ball Grid Array) chip reballing and repair. With an
ultra..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
AMAOE BGA iPhone 13 Pro Max Middle Layer Reballing Stencil High-precision 0.10mm AMAOE Middle Layer / Frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair techni..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MQ 3
Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MMThis high-quality MQ3 reballing stencil is engineered for
repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm
thickness and laser-cut precision, it allows technicians to restore solder
balls on ICs used in m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MU-6
AMAOE MU-6 Multi-Module BGA Reballing StencilThe AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level r..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: QU-9
Amaoe QU-9 BGA Reballing Stencil for Qualcomm ModulesThe AMAOE QU-9 BGA reballing stencil is engineered for high-precision rework of Qualcomm chipsets including SM8750, SM8635, SM8650, SM8550, SM8450, and SM7550. Designed to meet the rigorous demands of mobile motherboard repairs, it ensures sharp, ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: S23 FE-012
AMAOE S23 FE-012 Middle Frame Premium BGA reballing stencil for Samsung S23 FE middle frame components, ensuring precise solder ball placement during chipset repair and replacement. Features:High-quality stainless steel constructionThickness: 0.12MMHeat-resistant design for prolonged useCo..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD7
Amaoe U-QSD7 Stencil for Snapdragon 7-SeriesPremium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel constructio..
₹140.00
Ex Tax:₹140.00
Brand: BGTOOLS (Bagua)
Item Code/Product Code: Mini one
Bagua Mini One IC Heater Glue Removal Heater 160°C–250°C Range for Mobile Logic Board RepairBagua Mini-One Heater IC Glue Removal—also known as BG Tools Mini-One Heater—is a compact, high-efficiency heating tool specially designed for safe and precise IC glue removal in mobile phone ..
₹950.00 ₹1,050.00
Ex Tax:₹950.00
Brand: Flash 64
Item Code/Product Code: FPC V2
Flash 64 ISP V2 UFS and EMMC Direct Programming Adapter For Advanced Data RepairWhen devices cannot communicate through standard ports, technicians need direct ISP level access to UFS and eMMC storage chips. The Flash 64 UFS and EMMC ISP V2 Adapter With Flex Cable Set is designed for professional mo..
₹2,699.00 ₹3,000.00
Ex Tax:₹2,699.00
Brand: Flash 64
Item Code/Product Code: F64 Ultra
Flash F64 Ultra UFS eMMC Programmer Full Toolkit for Chip-Off Data Recovery Flash F64 Ultra UFS eMMC Programmer Complete Full Kit Set is an all-in-one high-efficiency solution for technicians working on chip-level memory repair, firmware flashing, and data recovery. This advanced tool supports ..
₹55,500.00 ₹58,000.00
Ex Tax:₹55,500.00