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Products meeting the search criteria
Item Code/Product Code: IP PRO MAX
The Aluminium Mould With Silicone Mat Mold Laminator For Iphone 12 Pro Max Ensures Precise Screen Lamination And Glass Bonding. The Durable Aluminum Mould And Silicone Mat Provide Secure Alignment, Making It Ideal For Efficient And Safe Iphone 12 Pro Max Screen Repairs...
₹1,049.00
Ex Tax:₹1,049.00
-17 %
Item Code/Product Code: IP 12
The Aluminium Mould With Silicone Mat Mold Laminator For Iphone 12 Series Is Designed For Precise Screen Lamination And Glass Bonding. The Durable Aluminum Mould And Silicone Mat Ensure Secure Alignment, Making It Perfect For Efficient And Safe Repairs For Iphone 12 Models...
₹2,750.00 ₹3,300.00
Ex Tax:₹2,750.00
Item Code/Product Code: IP-12/12PRO
The Aluminium Mould With Silicone Mat Mold Laminator For Iphone 12/12 Pro Is Designed For Precise Screen Lamination And Glass Bonding. The Durable Aluminum Mould And Flexible Silicone Mat Ensure Accurate Alignment, Providing Secure, Efficient Repairs For Iphone 12/12 Pro Models...
₹1,049.00
Ex Tax:₹1,049.00
New
Brand: AMAOE
Item Code/Product Code: MI 4
The AMAOE MI-4 stencil module enables precise BGA reballing for MSM8994 / 8996 CPU chips, perfect for Xiaomi Mi4, Mi4i, and Mi Max repairs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: MI 8
The AMAOE MI-8 stencil module ensures precise BGA reballing for MSM8956 / 8976 / 8998 CPU chips, ideal for Xiaomi Mi8, Mi8 SE, and Mi Mix 3 repairs.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for ..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹350.00
Ex Tax:₹350.00
New
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
High-precision 0.10mm AMAOE middle layer / frame reballing stencil specifically engineered for iPhone 13 Pro Max MBGA baseband chip repair. Features perfect alignment, heat-resistant material, and precise ball placement for professional mobile repair technicians seeking reliable reballing solutions...
₹350.00
Ex Tax:₹350.00
New
Brand: AMAOE
Item Code/Product Code: U SMU2
AMAOE U-SMU2 BGA Reballing Stencil offers high-precision alignment and tin planting for CPU IC repair. Ideal for motherboard rework and soldering.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for pr..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-MTU3
Professional-grade reballing (AMAOE U MTU3 ) stencil for MediaTek Dimensity processors, providing precise BGA rework solution with accurate ball placement for reliable mobile device repair services.Features:High-precision stainless steel construction for extended durabilityLaser-cut holes for accura..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-QSD7
Premium Amaoe U-QSD7 Stencil reballing stencil for Qualcomm Snapdragon 7-series processors, providing precise BGA rework solution for mobile device repair technicians with accurate ball placement.FeaturesHigh-precision stainless steel construction for durabilityLaser-cut holes ensure accur..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: USCU2
AMAOE U SCU2 BGA Reballing Stencil enables precise tin planting for SCU2 Power ICs. Ideal for mobile motherboard-level repair and IC soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for prof..
₹145.00
Ex Tax:₹145.00
New
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹145.00
Ex Tax:₹145.00