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New
Brand: AMAOE
Item Code/Product Code: MIDDLE LAYER
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.FeaturesHigh-precisi..
₹350.00
Ex Tax:₹350.00
New
Brand: AMAOE
Item Code/Product Code: SAM-17
AMAOE SAM-17 BGA reballing stencil for Samsung Exynos processors, featuring precise hole positioning for professional motherboard repair and component rework.Features:Precision-engineered stainless steel construction for durabilityThickness 0.12MMHigh-temperature resistant for repeated useAcc..
₹145.00
Ex Tax:₹145.00
New
Brand: KOOCU
Item Code/Product Code: Universal Black
Premium universal black BGA reballing stencil for Qualcomm, MediaTek and Snapdragon processors. Precision-engineered for perfect solder ball placement during chip repairs.Features:Universal design compatible with multiple chip typesHigh-temperature resistant black materialPrecision-machined holes fo..
₹145.00
Ex Tax:₹145.00
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