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Brand: AMAOE
Item Code/Product Code: U HIS4
AMAOE U HIS4 0.12mm Precision Stencil For HiSilicon Baseband And Processor ICsThe AMAOE U-HIS4 Universal BGA Reballing Stencil is designed for accurate and stable reballing of HiSilicon chipset ICs used in advanced smartphone motherboards. Manufactured with 0.12mm laser-cut stainless steel, this ste..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U-QSD6
Amaoe Qualcomm bga stencil 0.12mm for precision ic reballingDuring Qualcomm IC reballing, inaccurate hole alignment or incorrect stencil thickness often causes uneven solder balls, short circuits, or weak joints. Generic stencils fail to match IC layouts, leading to repeated rework and wasted time.&..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U-QSD6
AMAOE U QSD6 0.12mm Precision Stencil For Qualcomm PM And Baseband ICsThe AMAOE U-QSD6 Universal BGA Reballing Stencil is engineered for precise reballing of Qualcomm power management and baseband ICs. With a 0.12mm stainless steel thickness, it delivers consistent solder volume, accurate pad alignm..
₹140.00
Ex Tax:₹140.00
New
Brand: AMAOE
Item Code/Product Code: U-QSU5
AMAOE U QSU5 0.12mm Precision Stencil For Snapdragon Gen Series CPUsThe AMAOE U-QSU5 Universal BGA Reballing Stencil is engineered for high-density Qualcomm Snapdragon CPU reballing, especially for newer Gen-series processors. Manufactured with 0.12mm laser-cut stainless steel, it delivers accurate ..
₹140.00
Ex Tax:₹140.00
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