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Brand: AMAOE
Item Code/Product Code: U HIS4
AMAOE U HIS4 0.12mm Precision Stencil For HiSilicon Baseband And Processor ICsThe AMAOE U-HIS4 Universal BGA Reballing Stencil is designed for accurate and stable reballing of HiSilicon chipset ICs used in advanced smartphone motherboards. Manufactured with 0.12mm laser-cut stainless steel, this ste..
₹140.00
Ex Tax:₹140.00
New
-14 %
Brand: AMAOE
Item Code/Product Code: U-QSD6
AMAOE U QSD6 0.12mm Precision Stencil For Qualcomm PM And Baseband ICsThe AMAOE U-QSD6 Universal BGA Reballing Stencil is engineered for precise reballing of Qualcomm power management and baseband ICs. With a 0.12mm stainless steel thickness, it delivers consistent solder volume, accurate pad alignm..
₹120.00 ₹140.00
Ex Tax:₹120.00
New
Brand: AMAOE
Item Code/Product Code: U-QSU5
AMAOE U QSU5 0.12mm Precision Stencil For Snapdragon Gen Series CPUsThe AMAOE U-QSU5 Universal BGA Reballing Stencil is engineered for high-density Qualcomm Snapdragon CPU reballing, especially for newer Gen-series processors. Manufactured with 0.12mm laser-cut stainless steel, it delivers accurate ..
₹140.00
Ex Tax:₹140.00
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