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Brand: AMAOE
Item Code/Product Code: BS 2
Amaoe BS-2 Stencil 0.12mm BGA Reballing Stencil for IC Chip & PCB RepairFeatures:..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: MBGA-13
Precision Stencil for Mbga-13 For Iphone 13 Circuitry Repairs:Model-Specific Design: Tailored specifically for the Mbga-13 For iPhone 13 , ensuring a perfect fit for precise repair work.High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding com..
₹165.00 ₹200.00
Ex Tax:₹165.00
Brand: AMAOE
Item Code/Product Code: OV-6
AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM
The AMAOE OV 6 BGA Reballing Stencil is a precision-engineered tool tailored for reballing CPU and IC chips in OPPO and VIVO smartphones. With a thickness of 0.12MM, it offers ideal balance between durability and flexibility, m..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: OV-7
Amaoe OV 7 BGA Reballing Stencil for OPPO and VIVO 0.12MMThe AMAOE OV 7 BGA Reballing Stencil is expertly designed for OPPO and VIVO motherboard repair and IC reballing tasks. Engineered with 0.12MM high-precision Japanese steel, this stencil ensures consistent solder deposition and optimal alignmen..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U HIS4
AMAOE U HIS4 0.12mm Precision Stencil For HiSilicon Baseband And Processor ICsThe AMAOE U-HIS4 Universal BGA Reballing Stencil is designed for accurate and stable reballing of HiSilicon chipset ICs used in advanced smartphone motherboards. Manufactured with 0.12mm laser-cut stainless steel, this ste..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U MTK 9
Amaoe U MTK9 Universal BGA Reballing Stencil 0.12mm For MediaTek CPUThe AMAOE U-MTK9 Universal BGA Reballing Stencil is engineered for professional reballing of MediaTek Dimensity and MT series CPUs. Designed with 0.12mm laser-cut stainless steel, it ensures accurate solder ball alignment, uniform h..
₹140.00 ₹200.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-QSD6
AMAOE U QSD6 0.12mm Precision Stencil For Qualcomm PM And Baseband ICsThe AMAOE U-QSD6 Universal BGA Reballing Stencil is engineered for precise reballing of Qualcomm power management and baseband ICs. With a 0.12mm stainless steel thickness, it delivers consistent solder volume, accurate pad alignm..
₹120.00 ₹140.00
Ex Tax:₹120.00
Brand: AMAOE
Item Code/Product Code: U-QSU5
AMAOE U QSU5 0.12mm Precision Stencil For Snapdragon Gen Series CPUsThe AMAOE U-QSU5 Universal BGA Reballing Stencil is engineered for high-density Qualcomm Snapdragon CPU reballing, especially for newer Gen-series processors. Manufactured with 0.12mm laser-cut stainless steel, it delivers accurate ..
₹140.00
Ex Tax:₹140.00
Brand: AMAOE
Item Code/Product Code: U-SMG5
AMAOE U-SMG5 BGA Reballing Stencil (0.12mm) supports SM6150, SM7150 CPU ICs for accurate tin planting and motherboard-level repair soldering tasks.Features:Made of strong stainless steel0.12mm thickness for accuracyReusable and durableEasy to use for mobile repairDurable, reusable design for p..
₹140.00
Ex Tax:₹140.00
Item Code/Product Code: 0.12MM
0.12MM Universal Stencils Plate.0.3/0.35/0.4/0.5/45Package Content*1x Kaisi 0.12MM Universal Stencils Plates ..
₹199.00
Ex Tax:₹199.00
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