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Brand: AMAOE
Item Code/Product Code: MI 3
The MI3 stencil is designed for MSM8916/8928/MT6592 CPUs found in Xiaomi Redmi Note, Redmi 2/2A devicesThe AMAOE MI3 stencil is a special tool for BGA reballing. Technicians use it for advanced repairs on smartphone motherboards, especially for Xiaomi devices. Here's what it's used for:The MI3 stenc..
₹140.00
Ex Tax:₹140.00
-250x250.jpg "Gizmo MQ6 Power Green Oil UV Stencil for Precise BGA IC Reballing")
New
Item Code/Product Code: MQ 6
Gizmo MQ6 Green Oil Stencil for Motherboard IC Base RepairThe Gizmo MQ6 Green Oil UV Stencil is designed for professional chip-level repair. It offers accurate UV oil masking for IC base treatment during reballing or IC removal.Key Features:
High precision IC pad alignment
Durable and reusable sta..
₹100.00
Ex Tax:₹100.00
-17 %
Out Of Stock
Brand: MECHANIC
Item Code/Product Code: IBGA 13 MAX
DescriptionMECHANIC IBGA13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X - 13 Pro Max Mini,Mechanic Middle Layer Tin Planting Platform iBGA13 MAX for iPhone X/XS/XS Max/11/11 Pro/11 Pro max/12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max Tin plan..
₹2,199.00 ₹2,650.00
Ex Tax:₹2,199.00
-250x250.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
-250x250.jpg "YCS Arc Pad BGA Tin Planting Magnetic Mat for CPU IC Chip Repair")
Out Of Stock
Brand: YCS
Item Code/Product Code: Arc Pad
YCS Arc Pad BGA Tin Planting Mat with Magnetic Steel Mesh for CPU/IC RepairThe YCS Arc Pad BGA Tin Planting Mat is a high-precision magnetic mat designed for professional CPU, IC, and hard disk soldering. Featuring strong magnetic adsorption and durable steel mesh, it ensures stable positioning of c..
₹299.00
Ex Tax:₹299.00
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