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WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D

WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
2-3 Days
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D
WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D

  • Product Id: 2869

  • Item Code/Product Code: EMMC/EMCP
  • Weight: 0.04kg
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₹550.00
Ex Tax: ₹550.00
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Description ;


WYLIE EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 3D.

3D WYLIE BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.


Features :
1. Brand New.
2. BGA stencil for reballing pins for MPC5554MZP132 BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net WYLIE Square Hole Heating Steel Mesh

Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material


MODEL NUMBERS SUPPORTED ;

BGA221

BGA153

BGA169

BGA254

BGA162

BGA186


Package Content*

1 x Wylie 6 In 1Bga Reballing Stencil For Emmc/Emcp/Ufs Ic Chip - 3D

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Tags: WYLIE , REBALLING PLATE , STENCILS , EMMC , UFS , PLATE ,

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