WYLIE 6 IN 1BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 3D

Description ;

WYLIE EMMC EMCP BGA Reballing Stencil for UFS Font BGA153 162 169 186 221 254 Universal Reballing Stencil 3D.

3D WYLIE BGA Stencil FOR EMMC/EMCP/UFS IC Chip Reballing Pins Solder Tin Plant Net Heating Template EMMC:2.

Features :
1. Brand New.
2. BGA stencil for reballing pins for MPC5554MZP132 BGA Stencil Car PC Board Controller IC Reballing Pins Solder Tin Plant Net WYLIE Square Hole Heating Steel Mesh

Advantage:
1. Deformation resistant material
2. Precise pins location
3. Square round hole
4. Good material

MODEL NUMBERS SUPPORTED ;

BGA221

BGA153

BGA169

BGA254

BGA162

BGA186

Package Content*

1 x Wylie 6 In 1Bga Reballing Stencil For Emmc/Emcp/Ufs Ic Chip - 3D