Relife RL-093A Ultra-Thin 0.1MM Copper Chip Heat Sink for BGA IC Cooling

Relife RL-093A Copper Chip Heat Sink for IC CPU Cooling 

The Relife RL-093A Copper Chip Heat Sink is crafted for professional mobile technicians to manage heat during IC reballing, CPU repair, or soldering tasks. Made from high-purity copper, it provides rapid thermal conductivity, drawing heat away from the chip and protecting delicate motherboard components from thermal shock or overheating. Essential for repair setups involving iPhones, Android phones, and other SoC-based logic boards.

Key Features

• High Thermal Conductivity: Pure copper composition ensures rapid and efficient heat dissipation for sensitive IC and CPU components.
• Ultra-Thin 0.1MM Design: Allows snug fit on uneven chip surfaces without adding height or affecting thermal contact.
• Protects from Overheating: Prevents chip damage during rework or soldering by stabilizing temperature levels. 
• Flexible & Cuttable Material: Can be trimmed to custom sizes for specific chip profiles and repair scenarios.
• Multi-Piece Pack for Efficiency: Comes in a 10-piece pack, ideal for technicians performing frequent repairs.

User Guide

• Clean the component surface – Ensure the chip or PCB area is free from residue, dust, or flux.
• Cut to size – Trim the copper sheet to cover the heat-generating component fully.
• Peel backing – Remove protective liner before application.
• Apply carefully – Place the heat sink on chip or board, flat and secure.
• Clamp or mesh – Use thermal-alloy mesh or clamp to maintain contact during heating.
• Heat/process – Perform rework or reballing procedure as usual.
• Remove after cooling – Once board temperature drops, gently remove the copper sheet.
• Clean residue – Remove any flux and store the copper sheet flat for reuse.

Benefits for Technicians

• Reduces thermal stress on ICs during soldering or hot air work
• Prolongs component lifespan by controlling temperature
• Helps maintain stable chip position while working
• Ideal for BGA rework, reballing, desoldering, and CPU paste use

Technician Tips

Pair with thermal paste or CPU gel for superior heat transfer. Place directly over IC before applying hot air. Ideal for logic board testing and repair where overheating may affect chip stability.

Package Includes

• 1 x Relife RL-093A Copper Heat Sink Sheets Box (0.1MM thickness) 

FAQ

• Q1: What is the use of a copper chip heat sink in mobile repair?
• A: It helps absorb and dissipate heat away from ICs or CPUs during high-temp tasks like reballing or soldering.
• Q2: Is the RL-093A reusable?
• A: Yes, it is highly durable and designed for repeated professional use.
• Q3: Can I use this with thermal paste or fever gel?
• A: Absolutely. It's ideal to combine with products like 2UUL SC10 for even better thermal management.