NEXST EMMC-3 (BLACK) BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP 0.15MM

Precision Stencil for EMMC Circuitry Repairs:

Features: 

• Model-Specific Design: Tailored specifically for the EMMC 3 For UFS/NAND series , ensuring a perfect fit for precise repair work.
• High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
• Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
• Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
• Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
• Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
• Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
• Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
• Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.

Model supported : 

1. BGA162
2. BGA153
3. BGA169
4. BGA221
5. BGA186
6. BGA297
7. BGA254
8. BGA178
9. BGA200
10. BGA110
11. BGA60
12. BGA70

This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.

Package Content*

1 x Stencil.