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AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES

AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
-28 %
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES
AMAOE MI-12 CPU BGA REBALLING STENCIL FOR REDMI SERIES

  • Product Id: 3164

  • Item Code/Product Code: MI-12
  • Weight: 0.02kg
AMAOE AMAOE
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Ex Tax: ₹145.00
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Amaoe MI12 0.12mm BGA Reballing Stencil for Xiaomi 10/10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU


Supported for:

  1. SM8250 RAM 
  2. SM 8250 CPU
  3. SM8250 CPU 2
  4. SM8250 RAM
  5. SNAPDRAGON 865
  6. REDMI K30 PRO
  7. REDMI 10
  8. REDMI 10 PRO


Package includes:

  • 1 x Stencil

Amaoe MI12 BGA Reballing Stencil Template For XIAOMI 10 Pro Redmi K30Pro Snapdragon 865 SM8250 CPU RAM Power ADUIO PM IC Chip - AliExpress


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Tags: AMAOE , REBALLING STENCILS , STENCILS , BALLPLATE , REDMI IC REBALLINREDMI NOTE 10/K30 PRO REBALLING STENCILS , AMAOE MI-12 ,

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