AMAOE MQ1 to MQ4 Series Reballing Stencil for MT6771V, SDM845B

AMAOE MQ 1-4 SERIES QUALCOMM/MTK POWER IC REWORK REBALLING STENCILS 0.12MM

When working with complex Qualcomm or MTK power ICs, precision matters. From solder ball placement to stable alignment, even a small error can lead to short circuits or unstable boards. The AMAOE MQ Series Reballing Stencils (MQ 1 to MQ 4) are trusted tools for technicians who demand accuracy and efficiency in chip-level repairs.

Key Features of the AMAOE MQ Series

Module-Specific Patterns

• Each MQ stencil (1–4) is matched to real-world chip layouts for Qualcomm and MTK CPUs, RAM, and Power ICs.
• Why it matters: Reduces trial-and-error in chip reballing and improves success rates.

Laser-Cut Hole Precision

• Uniform hole size and layout ensure accurate solder ball placement.
• Why it matters: Avoids bridging or misalignment that can cause board failure.

Durable Stainless Steel Build

• Maintains flatness and shape under high-temperature reflow.
• Why it matters: Long-lasting tool for repeated use in busy repair centers.

Anti-Slip Design

• Prevents stencil shifting during hot air or reflow processes.
• Why it matters: Ensures consistent, safe reballing even on high-density chips.

• 4 x MQ Stencil