Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MM

Amaoe MQ-3 Stencil for Qualcomm and MTK Power IC Rework 0.12MM

This high-quality MQ3 reballing stencil is engineered for repairing and reworking Qualcomm and MediaTek PMIC chips. With a durable 0.12mm thickness and laser-cut precision, it allows technicians to restore solder balls on ICs used in mobile logic boards. Compatible with top-performing chipsets like SM8250 and PM8350C, this stencil is a crucial tool for BGA repairs and component-level rework across a wide range of Android devices.

Supported Model Numbers;

• Snapdragon 865
• SM8250 CPU
• SM7250
• SM7150
• SM6150
• MT6885Z CPU 
• SM6125
• SM7150

Features

• Designed for Qualcomm and MTK PMIC chipsets
• Compatible with MQ3 BGA reballing platforms
• Ultra-fine 0.12mm stencil thickness
• Ideal for chip rework, soldering & logic board repair
• Heat-resistant and reusable stainless steel
• Clean, high-precision solder ball alignment
• Trusted by professional mobile repair technicians

Package Content*

1x Amaoe MQ-3 Qualcomm/MTK Power IC Rework Reballing Stencil