AMAOE OV 5 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM

AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO 0.12MM

AMAOE OV 5 BGA stencils are built for reballing power ICs on OPPO/VIVO smartphones. Made with durable Japanese steel and square-hole design for precise alignment. Ideal for professional-level IC rework and reballing with reliable heat resistance.

Feature Section

• Sternness: Super hard for consistent durability
• Hole Type: Precision square holes for clean solder ball placement
• Re-usable: Designed for repeated professional use
• Thickness: 0.12MM – ideal for stable reballing
• Heat Resistance: Withstands high-temp hot air rework stations
• Mode Support: Compatible with OPPO/VIVO Power Management ICs
• Application: Perfect for BGA chip reballing & pad repair tasks
• Usage Level: Suitable for expert repair technicians
• Design Accuracy: Tight tolerance for IC alignment precision

Model Numbers Supported;

• 53735
• PM7250
• PM7150A
• MT6359VPP
• 58255
• QPM5677
• 77040
• BGA221
• SDR865
• BGA153
• MT6190W
• 78191-21
• MT6635XP
• WCN3998
• PM7250B
• MT6885Z RAM
• MT6885Z CPU
• SM7250
• MT6360PP
• OPPO-REN03/3Pro/4/4Pro
• VIVO-X50/50Pro/Z6
• IQ00-21X

Package Content*

1x AMAOE OV 4 BGA REBALLING STENCILS FOR OPPO/VIVO : 0.12MM