Out Of Stock
AMAOE BGA iPhone 13 Pro Middle Layer Reballing Stencil for iPhone 13 Pro A15 Bionic CPU - 0.10MM
Id: 4064
- Item Code/Product Code: MIDDLE LAYER
- Weight: 0.05kg
- SKU: 19670
₹140.00
Ex Tax: ₹140.00
Professional-grade middle layer reballing stencil precisely engineered for A15 Bionic processor repair in iPhone 13 Pro models. This high-precision MBGA stencil ensures accurate solder ball placement during reballing procedures, facilitating reliable CPU repairs and restorations.
Features
- High-precision laser-cut stainless steel construction
- Accurate BGA ball positioning for A15 Bionic processors
- 0.10MM thickness for fine solder paste application
- Heat-resistant design for multiple reballing cycles
- Precisely calibrated hole dimensions matching factory specifications
- Anti-static protective case included
- Includes alignment markers for proper positioning
Model Numbers Supported
- iPhone 13 Pro (A2483)
- iPhone 13 Pro (A2636)
- iPhone 13 Pro (A2639)
- iPhone 13 Pro (A2640)
Package includes:
- 1 x Stencil
