Amaoe BS-2 Stencil 0.12mm Stencil BGA Reballing for IC Chip & PCB Repair

Amaoe BS-2 Stencil High-Precision 0.12mm BGA Reballing Stencil for IC Chip, PCB, and Logic Board Repair – Supports Modules like CPU, PMIC, NAND, and EMMC

Features:

1. 0.12mm ultra-thin stainless steel for high-precision BGA reballing
2. Compatible with CPU, PMIC, NAND, EMMC, and other common IC modules
3. Ideal for mobile phone and laptop motherboard repair
4. Durable, reusable design for professional rework environments
5. Precision-aligned holes for accurate solder ball placement

Package includes:

         1 x Stencil

Model Numbers Supported:

PM8005

PM8150

PM8150A

SDM845

SM8150

WCD9340

WCN3990

PX8368WM

EXY8895A

EXY8895B

EXY9810

EXY3470

EXY3475

EXY7570

EXY7580

EXY7880