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AMAOE E8535P CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1350 - 0.12MM

AMAOE E8535P CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1350 - 0.12MM
-30 % Out Of Stock
AMAOE E8535P CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1350 - 0.12MM

  • Id: 3641

  • Item Code/Product Code: E8535P
  • Weight: 0.01kg
  • SKU: 18382
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Ex Tax: ₹140.00
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AMAOE E8535P CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1350 - 0.12MM

Features :

1. Brand New.
2. BGA Stencil For Reballing Pins For BGA Stencil Pcb Board Controller Ic Reballing Pins Solder Tin Plant Net Amaoe Square Hole Heating Steel Mesh

Advantage:
1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material


Package Content*

1 X Amaoe Stencil.

AMAOE E8535P CPU BGA Reballing Stencil

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Tags: AMAOE , REBALLING STENCILS , BALL PLATE , STENCILS , CPU STENCILS , BGA REBALLING PLATE ,

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