AMAOE LPDDR-1 BGA REBALLING STENCIL FOR EMMC/EMCP/UFS IC CHIP - 0.15MM

Amaoe LPDDR-1 Emmc Emcp Bga Reballing Stencil For Ufs Font BGA Reballing Stencil 0.15MM.

The AMAOE LPDDR-1 BGA Reballing Stencil is a precision tool designed for IC chip repair, rework, and solder ball reballing. Built from durable steel with high alignment accuracy, it ensures efficient and safe motherboard or mobile logic board repair.

Features :

• Compatible with LPDDR-1 BGA IC chips
• Precise alignment holes for accurate reballing
• Ideal for phone and motherboard repair
• Supports professional soldering workflows
• Lightweight and easy to handle

Advantage:

1. Deformation Resistant Material
2. Precise Pins Location
3. Square Round Hole
4. Good Material

Model Numbers Supported ;

• BGA134
• BGA200
• BGA60
• BGA168
• BGA178
• BGA136

Package Content*

1 X Amaoe LPDDR-1 BGA Reballing Stencil For Emmc/Emcp/Ufs Ic Chip 0.15MM