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AMAOE MBGA-12Pro Stencil for iPhone 12 Pro Max Precision Middle Layer BGA Reballing for A14 Bionic Chip

AMAOE MBGA-12Pro Stencil for iPhone 12 Pro Max Precision Middle Layer BGA Reballing for A14 Bionic Chip
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AMAOE MBGA-12Pro Stencil for iPhone 12 Pro Max Precision Middle Layer BGA Reballing for A14 Bionic Chip
  • Id: 4049

  • Item Code/Product Code: MBGA-12Pro
  • Weight: 0.05kg
₹145.00
Ex Tax: ₹145.00
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AMAOE MBGA-12Pro Max Stencil for iPhone 12 Pro Max – High Precision Middle Layer Motherboard BGA Reballing Tool

Features:
  1. Made of strong stainless steel
  2. 0.12mm thickness for accuracy
  3. Reusable and durable
  4. Easy to use for mobile repair
  5. Durable, reusable design for professional rework environments
  6. Precision-aligned holes for accurate solder ball placement
Model Numbers Supported:
  1. iPhone 12 Pro Max
  2. A14 Bionic Chip
Package includes:
  • 1 x Stencil

AMAOE Mid Stencil for iPhone 12 Pro Max A14 Chip

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