AMAOE MU-6 Stencil for MT6989W/MT6985W/MT6886V/MT6897Z Rework 0.12MM

AMAOE MU-6 Multi-Module BGA Reballing Stencil

The AMAOE MU-6 stencil is designed for precision reballing of high-performance MediaTek chipsets. Compatible with multiple modules including MT6989W, MT6985W, MT6886V, MT6781V, MT6897Z, and MT6878V, it delivers reliable, accurate results for chip-level repair specialists.

Best Use Case

Perfect for technicians and repair labs handling various MediaTek-powered smartphones. Designed for professionals performing repeated BGA chip-level soldering and rework.

Key Features

• Hole Type: Square precision mesh
• Thickness: 0.12mm for optimal heat conduction
• Reusable: Built for multiple repair cycles
• Compatibility: Ideal for hot air and reflow soldering
• Application: Mobile motherboard and power IC rework

Benefits

• Supports a wide range of MediaTek SoCs
• Durable and heat-resistant material extends lifespan
• Ensures perfect ball placement for minimal rework
• Reduces IC soldering errors during repair
• Great for high-volume mobile repair shops

Supported Modules:

• MT6989W
• MT6985W
• MT6886V
• MT6781V
• MT6897Z
• MT6878V

Package includes:

• 1 x Stencil